CLP-103-02-L-D-BE-A-K

LOW PROFILE DUAL-WIPE SOCKET, .0

CLP-103-02-L-D-BE-A-K
Part Number:
CLP-103-02-L-D-BE-A-K
Manufacturer:
Samtec Inc.
Description:
LOW PROFILE DUAL-WIPE SOCKET, .0
RoHS:
YES
Manufacturer Standard Lead Time:
TBD
Standard Pack Quantity:
1

CLP-103-02-L-D-BE-A-K Specifications

Part Status:
Active
Number of Rows:
2
Mounting Type:
Surface Mount
Operating Temperature:
-55°C ~ 125°C
Contact Finish - Mating:
Gold
Ingress Protection:
-
Material Flammability Rating:
UL94 V-0
Contact Material:
Phosphor Bronze
Applications:
-
Number of Positions Loaded:
All
Termination:
Solder
Contact Type:
Female Socket
Style:
Board to Board
Fastening Type:
Push-Pull
Contact Shape:
Square
Contact Finish Thickness - Mating:
10.0µin (0.25µm)
Insulation Color:
Black
Mated Stacking Heights:
-
Contact Finish Thickness - Post:
-
Contact Finish - Post:
Tin
Number of Positions:
6
Pitch - Mating:
0.050" (1.27mm)
Connector Type:
Receptacle, Bottom Entry
Contact Length - Post:
-
Row Spacing - Mating:
0.050" (1.27mm)
Insulation Material:
Liquid Crystal Polymer (LCP)
Features:
Board Guide, Pick and Place
Insulation Height:
0.084" (2.14mm)
Current Rating (Amps):
3.3A per Contact
Voltage Rating:
240VAC, 330VDC

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