HSEC8-113-01-H-DV-A-BL-TR
0.80 MM HIGH-SPEED POWER/SIGNAL
HSEC8-113-01-H-DV-A-BL-TR Specifications
Part Status：
Active
Number of Positions：
26
Number of Rows：
2
Contact Finish：
Gold
Mounting Type：
Surface Mount
Operating Temperature：
-55°C ~ 125°C
Color：
Black
Contact Finish Thickness：
30.0µin (0.76µm)
Termination：
Solder
Gender：
Female
Contact Material：
Beryllium Copper
Features：
Board Guide, Board Lock
Read Out：
Dual
Contact Type：
Cantilever
Flange Feature：
-
Card Thickness：
0.062" (1.57mm)
Termination Rows：
2
Pitch：
0.031" (0.80mm)
Material - Insulation：
Liquid Crystal Polymer (LCP)
Card Type：
PCI Express™
Number of Positions/Bay/Row：
6; 7
