HSEC8-130-03-L-DV-A-WT-K-TR
0.80 MM HIGH-SPEED POWER/SIGNAL
HSEC8-130-03-L-DV-A-WT-K-TR Specifications
Part Status：
Active
Number of Rows：
2
Contact Finish：
Gold
Contact Finish Thickness：
10.0µin (0.25µm)
Mounting Type：
Surface Mount
Operating Temperature：
-55°C ~ 125°C
Color：
Black
Termination：
Solder
Number of Positions：
60
Gender：
Female
Contact Material：
Beryllium Copper
Read Out：
Dual
Contact Type：
Cantilever
Flange Feature：
-
Number of Positions/Bay/Row：
30
Termination Rows：
2
Pitch：
0.031" (0.80mm)
Material - Insulation：
Liquid Crystal Polymer (LCP)
Features：
Board Guide, Pick and Place, Solder Retention
Card Type：
PCI Express™
Card Thickness：
0.093" (2.36mm)
